Tag Archives: Automotive Semiconductor Advanced Packaging Market Research

The automotive semiconductor advanced packaging market is estimated to expand 12% from 2022 to 2030. Advances in packaging technology allow ICs to be connected to boards. It includes fan-out-wafer-level packaging, system-in-package, and 2.5D packaging, among others. The contemporary integrated circuit (IC) packaging sector in the automotive market has seen substantial growth as a direct result of the growing demand for ...